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Coretec Cleveland Inc. Certified to UL 94V-0 for Rigid Flex

TORONTO, ONTARIO -- (Marketwire) -- 11/19/09 -- Coretec Inc. (TSX: CYY) today announced that the company has received official notification from Underwriters Laboratories (UL) that it has been awarded 94V-0 certification for rigid flex PCBs manufactured at its Cleveland site.

"Coretec is one of a handful of companies worldwide that have been awarded UL 94V-0 for rigid flex PCBs. The achievement of this key certification by our Cleveland team is an indication of our ongoing commitment to addressing as many rigid flex requirements as possible. This PCB technology has typically been associated with the military and aerospace electronic equipment sector due to its high reliability characteristics and 3D interconnection ability. But more and more, and for the same reasons, rigid flex designs are being incorporated into commercial applications such as medical instrumentation, handheld electronics, advanced camera and video equipment, measurement and test devices and transportation instruments. Commercial electronic equipment manufacturers typically require UL flammability certification for PCBs that are incorporated into their products. As such, Coretec is now in a much improved position to assist customers across all end markets with developing products embracing rigid flex interconnection. The demand for rigid flex PCBs is roughly $150-$200 million annually in North America. The market is projected to be one of the fastest growing segments of the PCB industry in the coming years as a result of it being a staple design methodology for defence, avionics and space applications as well as the increasing adoption rate amongst commercial electronic product designers", said Paul Langston, Coretec's President and CEO.

About Coretec

Coretec is one of the leading designers and fabricators of printed circuit boards for the prototype and quick turnaround production segments of the North American and European markets. Coretec distinguishes itself from its competitors by providing an extensive suite of printed circuit board services including field applications engineering support and education; technology roadmap consulting, CAD layout; rapid response manufacturing for prototypes; quick turn production for small-to-middle volume quantity requirements; and facilitation of higher volume requirements via partnerships in lower cost jurisdictions. The Company is also differentiated by its broad range of PCB technologies.

Caution Regarding Forward Looking Information

This news release contains "forward-looking statements" within the meaning of the United States Securities Litigation Reform Act of 1995, and applicable Canadian Securities Legislation. Forward-looking statements include, but are not limited to, statements with respect to financial performance, opportunities, new market for growth and financial position. Generally these forward-looking statements can be identified by the use of forward-looking terminology such as "plans", "expects" or "does not expect", "is expected", "budget", "scheduled", "estimates", "forecast", "intends", "anticipates", or "does not anticipate", or "believes" or variations of such words and phrases, or state that certain actions, events or results "may", "could", "would", "might", or "will be taken", "occur", or "be achieved". Please be cautioned that any such forward-looking statements are not guarantees of future performance and involve significant risks and uncertainties. Actual results or developments may vary materially from those projected or implied in the forward-looking statements as a result of any number of factors, including currency exchange rate fluctuations; variability of operating results; dependence on certain industries; management of growth and expansion; integration of operations; ability to attract and retain key personnel; nature of sales; product complexity and product defects; international operations; material cost fluctuations and limited availability of raw materials; potential loss of customers; competition; industry contraction and slow economic growth; technological change and process development; environmental liability; need for additional financing; product liability; pricing pressure; ability to reduce costs; and other risks discussed in the section entitled "Risk Factors" in Coretec's Annual Information Form dated March 26, 2009 which can be obtained at www.sedar.com.

Contacts:
Coretec Inc.
Paul Langston
Chief Executive Officer
416-208-2160
[email protected]

Coretec Inc.
Aaron Ames
Chief Financial Officer
416-208-2165
[email protected]

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